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Printed Circuit Design Issue (12/2000)

This is the seventh edition of The Board Authority (TBA) and my third as its industry guest editor. Unlike other publications, The Board Authority is the product of industry experts and the publication's Advisory Board. CircuiTree provides the editing, publishing, and most importantly, the financing, but we in the industry do the writing. If you have an issue with our product, join us to make it better. Since we are amateurs in the publishing business, we must acknowledge the contributions of Steve Gold, Peggy Lukkasson, Roger Whitehouse, Roy Sakelson, Mark Hammermeister, and others on the CircuiTree staff.

Our contributing authors did the majority of the work in this journal. I have recruited them from all walks of the printed circuit design community. Their contributions have made this TBA a truly unique piece of technical journalism. We thank them for contributing their time and expertise to make this TBA successful. Why printed circuit design? This is where it starts!

The fourteen articles in this edition are collected here to educate and inform you on the technologies, needs, issues, and solutions available today. The articles will briefly cover most of the elements in designing a printed circuit. This will provide education to many of you, and even some new ideas to the design experts that have authored this journal. I hope you all find value in—and enjoy—this issue of The Board Authority.

HAPPY HOLDEN

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The Design is Finished and Gone to Fabrication, Now What?
Section 57
by ROY MATHENA
This article provides the design community with guidelines that, if followed, will result in a quality board being supplied by the fabricator in a timely manner while meeting the design intent.
$ 9.00 USD
The Internet Opportunity
Section 48
by PAWEL CHADZYNSKI
The schematic and PCB design data represents critical intellectual property and must be accessible to all in the organization throughout the entire product life cycle.
$ 9.00 USD
Printed Circuit Board Routing at the Threshold
Section 44
by DAVID WIENS
The changing times require a robust printed circuit board routing solution, one that addresses high-speed issues, handles new packaging and fabrication requirements, is both automatic and interactive, and is integrated and easy to use.
$ 9.00 USD
HDI DFM and Physical Design Verification
Section 39
by ROBYNNE HANUS
This article is written to aid engineers and designers in understanding the ideal process flow for the designing and manufacturing of HDI circuitry as it relates to DFM.
$ 9.00 USD
The New Printed Circuit Design Framework—Predictive Engineering
Section 38
by HAPPY HOLDEN
New Product Realization and Design For Manufacturing and Assembly has now started to become more visible as a program that can improve companies' time-to-market and lower product costs. This article will cover the interactions of DFM/A and the need for development of a new framework to coordinate the tradeoffs.
$ 9.00 USD
Advanced Package Design
Section 33
by KEVIN RINEBOLD
In high-performance computing, packaging plays a key role in determining system performance, while in portable electronics, packaging is a primary determinant of size, weight, and form-factor. The unique and challenging design requirements for BGA/CSP packages require specialized designtools optimized for rapid throughput and design for manufacture.
$ 9.00 USD
What Makes a Circuit "High Speed?"
Section 28
by LEE W. RITCHEY
What is going on that makes a circuit high speed instead of low speed? What is different about these high-speed circuits? Further, what needs to be done different when a circuit becomes high speed? This article answers those questions.
$ 9.00 USD
RFI/EMI Concerns: The Design Advisers
Section 24
by DR. BARRY O'SULLIVAN
Achieving first-time right design through the exploitation of company-specific Design for "X".
$ 9.00 USD
The Impact of Build-up Technologies on CAD Tools
Section 19
by DUNCAN HOOPER, STEVE BURDEN, AND HAPPY HOLDEN
It will not be possible to realize the full potential of build-up technology unless the CAD tools used during the design process are capable of exploiting all possible opportunities.
$ 9.00 USD
Signal Integrity
Section 18
by DR. ERIC BOGATIN
Higher performance designs can be implemented by incorporating new design rules, new technologies and new analysis tools to meet ever-shrinking schedules. This article discusses some signal integrity problems and their solutions.
$ 9.00 USD
Virtual Prototyping Printed Circuit Boards
Section 16
by PETER SANDBORN
The earliest stages of the design process provide the best opportunity to significantly impact a system's characteristics.
$ 9.00 USD

Individual Articles

PCB Design Process
Section 12
by LARRY CHURCH
This article examines the PCB design process and the needs of manufacturing.
$ 9.00 USD
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