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Microvia Formation/Imaging Issue (07/2000)

Greetings and welcome to the fifth Board Authority. I am pleased to be the guest editor for this issue, with its focal point being via formation and imaging. This is a broad topic.

When I was new in this industry, via formation meant drilling a hole and inserting an eyelet or z-wire. Simple. Electroless copper, and all that process entailed, soon took over and drilling followed by electroless copper (sometimes flashed, sometimes panel-plated) became the staple for virtually decades. Today, via formation is indeed an expansive subject. It will be impossible to fully cover this topic in one journal; however, we have tried to provide a spectrum of useful, informative, and even entertaining articles. We will start off with a view of what is to come. (No, the authors are not a 60's pop group.) We then present a sampling of some new and promising technologies.

One is a new deposition process that may fundamentally change the structure of the PWB by the end of the decade. The other is a unique imaging process that has made much developmental progress over the last two years. We then examine some of the best processes available today, and move on to a valuable perspective from one of the leading fabricators. You will also notice that along with high technology and new processes, there is a greater awareness and attention to environmental issues than ever before—not only in the manufacture of a PWB but in the design, composition, and use of the base and fabrication materials themselves.

In the last issue of this journal, Guest Editor Happy Holden made a comment that is worth paraphrasing. "The advertisers in The Board Authority are an integral part of the journal." The authors have worked long and hard to present their technology and their views. We at The Board Authority have insisted that the articles are as non-commercial as possible. There is value in commercialism however—therefore, to get the entire story, compare the commercial messages in a company's advertising with the information in its articles (and in its competitors' articles). I want to thank the authors for their efforts—the articles presented here and in past issues have been produced by some of the best and brightest minds in our industry.

They all have full-time jobs and other things to do, so I want them to know that their efforts are greatly appreciated. Finally, my thanks to the TBA staff for putting up with this novice guest editor. I hope you all find value in—and enjoy—this issue of The Board Authority.

DAN FEINBERG

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Individual Articles

You've Only Just Begun
Section 7
by RICHARD AND KAREN CARPENTER
It's a fun time to be in this business...
$ 9.00 USD
Thermal LDI: Meeting HDI Lithography Challenges
Section 10
by YOSSI ATIYA
A discussion of a new thermal direct imaging system and the benefits it brings to fine-line fabrication.
$ 9.00 USD
The "Thin Film" Between You and Next-Generation Products
Section 15
by JERRY SCHMITT, JAN HWANG, AND MARC LANGLOIS
A look at the new CCVD thin coating process and its potential to create pathways to next-generation products.
$ 9.00 USD
Microvias: Where Are We Going?
Section 18
by PETE GILMORE AND PHIL KNUDSEN
Some thoughts on improving the current fractured state of microvia technology and forcing a closer working relationship all along the supply chain.
$ 9.00 USD
Metalization Processes for Blind Vias
Section 22 by MICHAEL CARANO
By incorporating build-up technology, using redistribution layers, manufacturers can significantly increase routing density by forming small blind vias. This article describes how to reliably metalize these vias.
$ 9.00 USD
Microvia Friendly Materials
Section 31
by TODD YOUNG
This article addresses the ability to lase and plate microvias and the resultant thermal and electrical reliability that these processes and materials yield.
$ 9.00 USD
Microvias: A Manufacturer's Viewpoint
Section 38
by JOHN S. GROSSO
This article highlights specific areas of concern for the PWB manufacturer and addresses the future needs required by the manufacturer to be successful.
$ 9.00 USD
New Technology for Accurate Positioning of Circuitry on Microvia Panels
Section 42
by MATT KESLER, RANDY THOMPSON, AND JAMES J. HICKMAN, PH.D.
Changing the image formation process by using laser direct imaging for more accurate placement of images.
$ 9.00 USD
Copper on Polyimide Capsheet Composite for Ultra-Thin Applications
Section 48
by T.R. BERGSTRESSER, R.L. HILBURN, J.S. SALLO, AND J.A. YOCOM
The new capsheet composite material is designed to enhance the process of defining fine, outerlayer circuitry because it is readily manufactured with copper as thin as 3 µm.
$ 9.00 USD
Horizontal Process for Microvia Metalization
Section 54
by KEITH WARYOLD AND JOHN GEBHARDT
Will we soon see the first pattern plating horizontal electrolytic copper line enter the mass-production environment?
$ 9.00 USD
Mechanical and Laser Via Formation
Section 61
by MICHAEL KAUF, LEE EKBLAD, AND HENRY MARTINEZ
A discussion of mechanical and laser drilling that compares the advantages and disadvantages of both approaches in the context of current market and technology trends.
$ 9.00 USD
Laser Drillable E-Glass Multilayer Materials: An Overview of Laser Enhanced Materials
Section 67
by BOB FORCIER
A review of the properties and processing of a new generation of glass reinforced laminates for multilayer applications compared to resin coated copper, and standard multilayer materials.
$ 9.00 USD