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Electrical Test Inspection Issue (09/2000)

While PCB selling prices continue to decrease at the rate of six percent per year on average, production yields have become a priority for PCB fabricators who want to remain competitive. Achieving high yields demands a controlled fabrication control. To ensure that one's process is under control requires inspection and test at almost all stages: drilling, imaging, final control, etc. Finally, the feed back loop after inspection and test for process tuning is increasingly important.

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Individual Articles

The Role of Inspection in Chip Carrier Manufacturing
Section 12
by DANIEL HERMAN
This article covers AOI, LVI, and AVI inspection within the chip carrier manufacturing process.
$ 9.00 USD
AOI Solutions—Which One is Right for You?
Section 16
by ALEX NATANZON and AMIR GILEAD
There are many variables that influence the selection of the ideal system for your AOI needs. This article, together with the model presented, aids in the selection process of an AOI system.
$ 9.00 USD
Combining Automatic Optical Inspection and Electrical Test—a solution to be considered
Section 17
by RICHARD FRISK
Richard Frisk explains how this process combines the best from both the inspection and test processes to give unbeatable fault finding performance on printed circuit boards.
$ 9.00 USD
Automatically Inspecting Microvias
Section 22
by MARK OWEN
An examination of the results of a new inline AOI technology that allows the inspection of 15:1 aspect ratio through holes and blind holes as small as 100 microns (4 mils) diameter, at speeds faster than several multi-headed drills or laser drilling machines.
$ 9.00 USD
A Test Methodology for HDI Microvia and Traditional PWB Structures
Section 61
by BILL BIRCH
IST can provide information that will assist the designer in the selection of design rules commensurate with manufacturing capability and assembly restrictions or methods.
$ 9.00 USD
PWB Electrical Test Criteria Roadmap
Section 28
by SUBAHU DESAI AND ITRI—ELECTRICAL TEST PROJECT TEAM
This article establishes an industry-wide set of criteria for equipment developers and users to use when determining the needs of a future piece of equipment.
$ 9.00 USD
The Increasing Density and Decreasing Spacing Between Test Points in PCBs
Section 32
by ENRICO RIGO
Better fixture software, improved test equipment, and an integrated test floor approach may be the only way to accomplish a broad range of electrical test on one test floor.
$ 9.00 USD
Combinational Test: Reducing the Cost of High Density Electrical Test
Section 40
by THOMAS L. GUTHRIE
This article reviews the strengths and shortcomings of three families of bare board electrical test hardware, and the effects of these traits on cost per point tested. It also describes how the combinational test technique, supplied by a number of CAM vendors, can optimize the utilization of electrical test hardware.
$ 9.00 USD
Electrical Test Outsourcing: Partnership to a Total Solution
Section 46 by DAVE ADAMCZYCK
Is outsourcing an answer to your electrical test requirements?
$ 9.00 USD
Testing Embedded Passives
Section 49
by JOSEPH A. CONTI
Testing embedded passives has been with us for many years. The use of them is just expanding. It's the same book—just a different cover.
$ 9.00 USD
The Continued Evolution of Test Data Transfer Format IPC-D-356
Section 53
by DUANE DELFOSSE
This article describes a bit of the history of IPC-D-356, some of the areas where the standard is likely to change, and the progress of the effort underway to update the standard.
$ 9.00 USD
Controlled Impedance Test
Section 56
by MARTYN GAUDION
To ensure signal integrity in production, your designs must be carefully realized by your PCB fabricator.
$ 9.00 USD


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