This issue of The Board Authority is a first. It combines two distinct, yet closely related disciplines: Assembly and Solderability. They go together like wine and cheese, Laurel and Hardy—you get the picture. The solderability preservation of the bare board is generally the responsibility of the PWB fabricator. However, quality of the assembled PWB is generally measured by the strength and long-term reliability of the solder joint. Of course, there are a number of factors and variables that affect the solder joint. The surface finish quality is only one such factor. The other factors and variables are introduced in the assembly process itself. Wave solder parameters, the IR reflow profile, type of flux or solder paste used, temperature of assembly, flux application techniques, etc., can all influence the quality of the solder joint. That is why we were so determined to bring the readers a combined issue that would not only serve as a reference, but would also provide a better understanding of issues that both the fabricator and assembler face. We hoped to accomplish this through the support of CircuiTree and the expertise of industry leaders who agreed to commit this expertise to writing.
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