Metallization of Packaging Substrates: MHC Beyond the Rigid PCB
Section 4 by Rikiya Shimizu, Dennis Yee —The required characteristics of semiconductor package design with Rohm and Haas Electronic Materials adhesion promotion and electroless copper deposition processes.
$ 9.00 USD
Decoupling of High Performance Semiconductors Using Embedded Capacitor Technology
Section 10 by William Borland, Daniel Amey, and Karl H. Dietz —Results and discussion of an investigation by a joint program, initiated and sponsored by DuPont with the Georgia Institute of Technology Packaging Research Center (PRC), of the integration of embedded Thick Film capacitors and HiK polyimide-based planar capacitor materials in IC packages.
$ 9.00 USD
Industry Direction in Implementing Embedded Components
Section 16 by Dr. Richard Ulrich —An overview to help electronics manufacturers become familiar with the state of the art, its current applications, and what can be done to more easily implement embedded components into their products.
$ 9.00 USD
Thermosonic Low Temperature COF Interconnection
Section 19 by Yoshikazu Hirayama —An innovative flip chip technology “Thermosonic Low Temperature Interconnection” has been developed as the next generation COF packaging process with less than 30 microns pitch.
$ 9.00 USD
A Novel IC Packaging Approach
Section 22 by Anna Fontanelli —SiP is a modular design approach offering unprecedented flexibility in the development of systems. An intelligent partitioning of all the components of the electronic system is key to achieving greater functionality in a smaller area, combining dissimilar device types and high-yielding memory devices with similar size and wiring requirements.
$ 9.00 USD
Dynamic Applications of Adhesiveless Electro-Deposited Copper/Polyimide Laminates
Section 26 Matthew Heim —Traditionally, Actuator Flex Circuits (AFCs) in hard disc and tape drives have been fabricated using a KaptonHN polyimide/adhesive/ Rolled-Annealed Copper (RACu) base laminate. Switching to an adhesiveless KaptonE polyimide/Electro-Deposited Copper (EDCu) base laminate can often provide a solution path with equal or improved performance.
$ 9.00 USD
Reliable Flip Chip Assembly on Flexible Boards by Tin/Gold Bonding for Display Modules
Section 32 by Sung-Woong Choi — Flip chip packaging is rapidly replacing wire bonding because it can meet high speed requirements. Are you ready?
$ 9.00 USD
Blind Micro Via and Through Hole Filling for Thin Core and Flexible Base Materials
Section 35 by Stephen Kenny —The latest results obtained from horizontal conveyorized equipment ideally suited for the production of thin core and flexible materials.
$ 9.00 USD
Ultra-Smooth Copper Foil for Fine Pitch COF and FPC
Section 38 by Takuya Yamamoto, John Andresakis, Naomitsu Inoue, and Masayuki Misawa —Polyimide casting base FCCL has had several critical performance issues that allow sputtered base FCCL to lead the market in substrate for COF. With the newly developed, ultra-smooth copper foil, DFF®, it has opened a door for polyimide casting and laminate base FCCL to compete with sputtered base FCCL.
$ 9.00 USD
A Future In Flex
Section 42 by Merle Tingelstad —The combination of high density surface mount technology (SMT), micro-electromechanical systems (MEMS) and nano-scale construction enables a new wave of medical devices that benefit from increased use of flexible circuits.
$ 9.00 USD
Adhesiveless Copper on Polyimide Substrates for Medical Applications
Section 44 by Tad Bergstresser, J. Mestdagh, and S. Storme —An in-depth discussion of adhesiveless copper-on-polyimide laminate properties, as they pertain to ultrasound interconnect requirements.
$ 9.00 USD
Burr and Stress-Free Cutting of Flexible Printed Circuits Using UV-laser Technology
Section 50 by Dr. Marc Hüske, Dr. Dieter Meier —Laser cutting has already proven to be a technology well suited to complement conventional cutting technologies in prototyping,
pre-series and low-volume production. By reducing product changeover time, increasing accuracy and eliminating tooling costs these systems produce a better product at a lower cost.
$ 9.00 USD
Staying Flexible: Utilizing Flying Probe Testers for Flexible Circuit Boards
Section 54 by Jeff Hagopian —What are the challenges of flexible circuit tests? We evaluate the use of flying probe testers as a preferable solution for flexible circuit board electrical test.
$ 9.00 USD
Five-Year Projection of the Global Flexible Circuit Market
Section 60 by Robert Turunen, Dominique Numakura and James J. Hickman —An investigation into the future of the flex industry to 2010 has been conducted. A new market research process has been developed to estimate the global market size of all kinds of flexible circuits in the next five years. Conventional flex circuits and advanced flex circuits are studied individually and reported on separately.
$ 9.00 USD
Evaluating New FR4 Laminates for Reliability in Rigid-Flex and Substrates
Section 64 by Happy Holden —An investigation of the reliability of the newer higher-temperature resistant FR-4s used for a 0.034” eight (8)–layer, all FR-4 rigid-flex subjected to lead-free, RoHS compliant assembly temperatures and rework.
$ 9.00 USD
Rigid-Flex Comes of Age
Section 70 by Michael Schumacher —Technical and commercial reasons to deploy flexible circuit interconnect solutions in the military/aerospace industries.
$ 9.00 USD
Pre-Treatment and PTH Solutions for Flex-Rigid PCBs
Section 74 by Colin Devenny, Lars-Eric Pribyl —A discussion of some of the difficulties faced by flex and flex-rigid PCB manufacturers: desmearing different lay-ups of flex-rigid, electroless copper pre-treatment concepts, as well as a direct concept will be discussed showing the benefits and results for even the most demanding of board layouts and materials.
$ 9.00 USD
Understanding and Accelerating the UL Certifi cation process for Rigid-Flex PCBs
Section 78 by Crystal Vanderpan —An overview of the material, process, and certification parameters to consider when moving to a flexible or rigid-flex PCB, providing guidance for accelerating the UL certification process.
$ 9.00 USD
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As the title implies, this year’s edition of The Board Authority focuses on a cluster of related topics, all of which are quite timely. IC packaging substrates have become very complex,
especially flip chip BGA packages and stacked packages that require new material
solutions for signal integrity and reliability. The links from IC packaging to flexible
circuit technologies are the familiar chipon- flex, roll-to-roll processing, and flex for
TAB applications. The thinness, chemical resistance, and high break-down voltage of
polyimides are very attractive properties in many packaging applications. Redistribution
layers in wafer-level packaging often use polyimide dielectrics for rerouting the wafer’s I/Os for area array packaging.
